Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
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100% polyimide. It has excellent strength, heat resistance, and electrical properties.
If the materials for processing are in stock, same-day shipping is possible. The size chart is available on our website. Please take a look.
Material for machining processed by compression molding of PI.
The "6000 Series" is a machining material made from compressed PI (polyimide). PI resin has high mechanical strength and excellent heat resistance, electrical insulation, and chemical resistance, making it widely used in aerospace, automotive, and electrical and electronic fields. 【Features】 ■ Excellent mechanical properties ■ High heat resistance ■ Glass transition temperature: ~335°C ■ Load deflection temperature: ~320°C *For more details, please refer to the PDF materials on the official website or feel free to contact us.
Suitable for super engineering plastics with good dielectric properties in a wide frequency range and materials for next-generation (5G) communication devices.
Due to its excellent dielectric properties and high temperature and humidity resistance, "Therplim" can be used in 5G-related materials (copper-clad laminates), CFRP raw materials, and audio equipment components. [Features] ■ Good dielectric characteristics across a wide frequency range, including the millimeter wave region (10GHz 2.7) ■ High heat resistance (Tm323℃/Tg185℃) ■ Good chemical resistance, insoluble in solvents ■ Can be processed from films below 25 μm to large components with a thickness of 100 mm * For more details, please refer to the PDF document or feel free to contact us.
Excellent heat resistance with a continuous use temperature of 288°C. Outgassing is also reduced. Material property table and price list are being distributed [Remote consultations are also available].
"Besper" is a DuPont manufactured fully aromatic polyimide resin that boasts exceptional heat resistance, capable of supporting high loads without softening even at high temperatures. In addition to "SP-1," which is made of 100% polyimide resin and excels in mechanical strength and electrical and thermal insulation properties, we offer a variety of grades that can be selected based on application needs, including sliding properties, static elimination performance, and dimensional stability under high loads. 【Features】 ■ Continuous use temperature is 288°C, intermittent use temperature is 480°C ■ Low outgassing, making it suitable for environments requiring high cleanliness, such as the semiconductor field ■ Prevents damage to transported items when used in transport rollers ■ "SP-1" can be used for insulation parts, insulating components, valves, glass substrates, lenses, bearings, transport suction nozzles, seal rings, and plasma-resistant parts. *We are currently publishing a property table that includes "SP-1" and "SCP-5000 (high strength and chemical resistance)," as well as a price list for "SP-1" and "SP-202 (static elimination grade)." You can view it via “PDF download.” Please feel free to contact us with any inquiries.
Besper(R)
Bespel® is a high-heat-resistant plastic (fully aromatic polyimide resin) developed by DuPont. It has the best heat resistance and wear resistance among engineering plastics and is used in a wide range of applications, including mechanical and electrical components. 【Features】 1. Excellent heat resistance. It can be used continuously at 288°C and intermittently at 480°C. 2. Excellent wear resistance. The limit PV value is more than 10 times that of general plastics. 3. Excellent creep resistance. Creep at 260°C and 18.2MPa is only 0.6% after 1000 hours. 4. Excellent electrical properties. Insulation strength is 22KV/mm. 5. Additionally, it excels in plasma resistance, radiation resistance, gas release resistance (under vacuum), and chemical resistance.
![Precision machining of polyimide resin (PI resin) [SCM8000]](https://image.mono.ipros.com/public/product/image/659/2001485990/IPROS32746673134494526121.png?w=280&h=280)
We offer precision machining of the SCM8000 from PBI Corporation. We have a large inventory. From small lots of 1 piece to mass production!
The SCM8000 is a machining material made from ultra-high heat-resistant polyimide UPI natural grade, compressed and molded using the PBI method. It features ultra heat resistance, a load deflection temperature of up to 480°C, excellent mechanical properties, good wear resistance, low water absorption, and anti-static/conductive properties. We respond to customer needs with advanced processing technology tailored to the characteristics of PBI resin. 【Key physical properties at 23°C (partial)】 ■ Tensile strength: 100 MPa (Standard ISO 527) ■ Tensile strain: 2.0% (Standard ISO 527) ■ Flexural strength: 190 MPa (Standard ISO 178) ■ Flexural modulus: 7.0 GPa (Standard ISO 178) ■ Charpy impact strength (notched): 1.5 kJ/m² (Standard ISO 179) *You can view our available equipment by downloading the PDF. Please feel free to contact us for any other inquiries.
Biphenyl tetracarboxylic dianhydride (BPDA) and diamine condensation polymerization!
We would like to introduce the cutting processing material "PI resin (BPDA)" that we handle. It is an all-aromatic polyimide resin produced by the polycondensation of biphenyl tetracarboxylic acid dianhydride (BPDA) and diamines. The compression molding grades include "SCP-5000," which excels in dimensional stability under humid conditions, and "SCM8000," which has good wear resistance. 【Features of SCP-5000】 - Improved rigidity and impact strength compared to aromatic polyimide resin SP-1 - Enhanced long-term high-temperature exposure resistance (with a Tg point of 380°C) - Excellent dimensional stability under humid conditions *For more details, please refer to the related links or feel free to contact us.
Is there a technology that can micronize high heat-resistant polyimide? I will teach you a method to mass-produce uniform polyimide microparticles with consistent particle size.
Speaker Dr. Takayuki Ishizaka, Researcher, Compact Chemical Systems Research Center, National Institute of Advanced Industrial Science and Technology (AIST) Target Audience: Engineers, researchers, and beginners interested in polymer microparticles and polyimide technology Venue: Tekno Kawasaki, 4th Floor Exhibition Hall [Kanagawa, Kawasaki City] 5-minute walk from Tokyu Mizonokuchi Station East Exit or JR Musashi-Mizonokuchi Station Date and Time: October 26, 2011 (Wednesday) 13:30-16:30 Capacity: 30 people *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] 46,200 yen (tax included, including text costs) for up to 2 participants from one company *Limited to Tech-Zone members who apply by October 12. Membership registration is free. *After October 12, the [Regular Price] will be 49,350 yen (tax included, including text costs) for up to 2 participants from one company. ◆If 3 participants from the same organization apply, the fee will be 69,300 yen.
